Open Access Article
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Correction: Copper particle-free ink with enhanced performance for inkjet-printed flexible UWB antennas
Wendong
Yang
*ab,
Zhichao
Dong
ab,
Zihao
Guo
ab and
Haoqiang
Sun
ab
aSchool of Electronic and Information Engineering, Liaoning Technical University, No. 188, Longwan South Street, Huludao City, 125105 Liaoning, China. E-mail: wendong_2007@163.com
bKey Laboratory of Radio Frequency and Big Data for Intelligent Applications, Liaoning Technical University, Huludao City, 125105 Liaoning, China
First published on 8th November 2023
Abstract
Correction for ‘Copper particle-free ink with enhanced performance for inkjet-printed flexible UWB antennas’ by Wendong Yang et al., J. Mater. Chem. C, 2023, 11, 14429–14438, https://doi.org/10.1039/D3TC02515B.
The authors regret an error in Fig. 4 of the published article, where Fig. 4a was unfortunately replaced with a duplicate of Fig. 4b. The corrected version of Fig. 4 is shown here (the caption remains unchanged).
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| Fig. 4 XRD, surface morphologies and EDS results of the produced copper films from (a) and (c)–(e) Cuf-DAP ink and (b) and (f)–(h) Cuf-OA ink sintered at 170 °C for 60 minutes. | ||
The Royal Society of Chemistry apologises for these errors and any consequent inconvenience to authors and readers.
| This journal is © The Royal Society of Chemistry 2023 |