James Bourely, Nicolas Fumeaux, Xavier Aeby, Jaemin Kim, Gilberto Siqueira, Christian Beyer, David Schmid, Oleksandr Vorobyov, Gustav Nyström and Danick Briand

Nat Commun, 2025, 16
DOI: 10.1038/s41467-025-65458-9

Fabrication of Nano Copper Highly Conductive and Flexible Printed Electronics by Direct Ink Writing

Peng Zhang, Qinghua Sun, Shiyao Fang, Hui Guo, Kang Liu, Linfu Zhang, Qiang Zhu and Min Wang

ACS Appl. Mater. Interfaces, 2025, 17, 1847
DOI: 10.1021/acsami.4c14225

End-of-life options for printed electronics in municipal solid waste streams: a review of the challenges, opportunities, and sustainability implications

Mohammad Naji Nassajfar, Mariam Abdulkareem and Mika Horttanainen

Flex. Print. Electron., 2024, 9, 033002
DOI: 10.1088/2058-8585/ad699b

Self-stacking two-layer conductive films for enhanced oxidation and low electrical resistance from hybrid ink of cobalt/copper

Ryota Sakaida and Hideya Kawasaki

Materials Letters, 2024, 362, 136238
DOI: 10.1016/j.matlet.2024.136238

Improving solder wettability atop screen-printed copper for flexible hybrid electronic circuit assembly

François-Xavier Fortier, Luis-Felipe Gerlein, Jaime Benavides-Guerrero, Arjun Wadhwa, Krunal Shah, Mohamad Hassan Taherian, Alexandre Perrotton, Martin Bolduc and Sylvain G Cloutier

Flex. Print. Electron., 2025, 10, 045011
DOI: 10.1088/2058-8585/ae19f7

Rapid Fabrication of Flexible Cu@Ag Flake/SAE Composites with Exceptional EMIS and Joule Heating Performance

Zhongxin Huang, Yong Zhang, Huipeng Wang, Yuanyuan Li, Jiewu Cui, Yan Wang, Jiaqin Liu and Yucheng Wu

ACS Omega, 2023, 8, 37032
DOI: 10.1021/acsomega.3c04404

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Saurabh Khuje, Firas Alshatnawi, Detlef Smilgies, Mohammed Alhendi, Abdullah Islam, Jason Armstrong, Jian Yu, Mark Poliks and Shenqiang Ren

Adv Funct Materials, 2024, 34
DOI: 10.1002/adfm.202311085

In situ production of copper nanoparticles by laser-induced forward transfer: prospects for application in microelectronics

Alena Nastulyavichus, Nikita Smirnov, Evgenia Ulturgasheva, Irina Dzhun, Nikolay Pokryshkin, Sofia Babina and Sergey Kudryashov

Opt Quant Electron, 2025, 57
DOI: 10.1007/s11082-025-08554-w

Printing of passive RFID tag antennas on flexible substrates for long read distance applications: Materials and techniques

Mohd Nizar Hamidon, Tark D. Farnana, Intan H. Hasan, Aduwati Sali and Maryam Md. Isa

Journal of Science: Advanced Materials and Devices, 2024, 9, 100778
DOI: 10.1016/j.jsamd.2024.100778

Disposable Printed Electrode Made with Chinese Shellac and Carbon Black for Melatonin Detection

Ana Luiza Molina de Cezar, Rafaela Cristina Freitas, Amanda Neumann and Bruno Campos Janegitz

ACS Meas. Sci. Au, 2025, 5, 572
DOI: 10.1021/acsmeasuresciau.5c00056

Insight into the Types of Alkanolamines on the Properties of Copper(II) Formate-Based Conductive Ink

Wendong Yang, Zihao Guo, Xun Zhao, Xiaoyuan Zhang and Emil J. W. List-Kratochvil

Langmuir, 2024, 40, 7095
DOI: 10.1021/acs.langmuir.4c00221

Study on the corrosion resistance of new reticulated organic polymerized film on copper foil surface

Yong Liu, Xin Ma, Shuai Wang, Hong Zhong and Zhanfang Cao

Progress in Organic Coatings, 2024, 194, 108609
DOI: 10.1016/j.porgcoat.2024.108609

Tissue‐Adhesive and Stiffness‐Adaptive Neural Electrodes Fabricated Through Laser‐Based Direct Patterning

Jaehyon Kim, Yewon Kim, Kyoungryong Kim, Hyunjin Jung, Duhwan Seong, Mikyung Shin and Donghee Son

Small Methods, 2025, 9
DOI: 10.1002/smtd.202401796

Unveiling the Trigger Role of Laser Reflections in Laser Direct Patterning of Copper

Sung Il Ahn, Ho-Yeol Park and Sajal Chakraborty

ACS Appl. Mater. Interfaces, 2025, 17, 41330
DOI: 10.1021/acsami.5c08717

Room temperature compressed air-stable conductive copper films for flexible electronics

H. Jessica Pereira, Oleg Makarovsky, David. B. Amabilino and Graham N. Newton

npj Flex Electron, 2024, 8
DOI: 10.1038/s41528-024-00331-1

Optimised properties of conductive polyaniline-polyvinyl alcohol ink painted on paper for ductile pressure sensor with reduced electrical drift

Jayanta Das, Debadrita Dasgupta, Krishna Deb and Biswajit Saha

Materials Science and Engineering: B, 2025, 311, 117850
DOI: 10.1016/j.mseb.2024.117850

Recent advances in protective technologies against copper corrosion

Xiaomeng She, Jian Peng, Yujie Qiang, Yue Zhou and Song Zhang

Journal of Materials Science & Technology, 2024, 201, 75
DOI: 10.1016/j.jmst.2024.02.060

In Situ Rheoimpedance and Thermogravimetry–Differential Thermal Analysis of Copper-Based Conductive Inks for High-Oxidation-Resistant Performance

Reina Ishikawa, Yuki Kawata and Hideya Kawasaki

ACS Appl. Electron. Mater., 2025, 7, 1736
DOI: 10.1021/acsaelm.4c01894

Copper Paste Printed Paper‐Based Dual‐Band Antenna for Wearable Wireless Electronics

Wendong Yang, Xun Zhao, Jingchang Nan, Michael Hengge and Emil J. W. List‐Kratochvil

Adv Elect Materials, 2025, 11
DOI: 10.1002/aelm.202400522

Photonic sintering of copper for rapid processing of thick film conducting circuits on FTO coated glass

Bahaa Abbas, Eifion Jewell, Yin Cheung Lau, Justin Searle and Tim Claypole

Sci Rep, 2023, 13
DOI: 10.1038/s41598-023-32044-2

Powder Bed Fabrication of Copper: A Comprehensive Literature Review

Vi Ho, Leila Ladani, Jafar Razmi, Samira Gruber, Anthony Bruce Murphy, Cherry Chen, Daniel East and Elena Lopez

Metals, 2025, 15, 1114
DOI: 10.3390/met15101114

On‐Demand Sintering of Gold Nanoparticles via Controlled Removal of o‐Nitrobenzyl Thiol Ligands Under Record‐Low Power for Conductive Patterns

Jisun Im, Charles Heaton, Nur R. E. Putri, Changxu Liu, Junichi Usuba, Kevin Butler, Michael Fay, Grace G. D. Han, Helia Hooshmand, Adam Thompson, Ricky Wildman, Richard Hague, Lyudmila Turyanska and Christopher Tuck

Advanced Science, 2025, 12
DOI: 10.1002/advs.202415496

Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders

Fei Han, Mei Cao, Jiali Lin, Ting Liu and Xiaoxin Zhu

Materials Science and Technology, 2024, 40, 931
DOI: 10.1177/02670836241234020

An interesting aggregation induced red shifted emissive and ESIPT active hydroxycoumarin tagged symmetrical azine: Colorimetric and fluorescent turn on–off–on response towards Cu2+ and Cysteine, real sample analysis and logic gate application

Moorthy Mathivanan, Jan Grzegorz Malecki and Balasubramanian Murugesapandian

Spectrochimica Acta Part A: Molecular and Biomolecular Spectroscopy, 2025, 326, 125270
DOI: 10.1016/j.saa.2024.125270

Printed RFID systems for sustainable IoT: synergistic advances in conductive inks, antenna architectures, and scalable manufacturing

Xintai Wang, Maksim Kuznetcov, Wenfeng Jiang, Zhongyu Tang, Zhangchenyu Wei, Aili Zhang, Naixu Wei and Xiaoying Li

Front. Electron., 2025, 6
DOI: 10.3389/felec.2025.1697449

Fabrication of high reliability Cu joints at low temperatures using synergistic effect of organic composition for power device packaging

Quan Sun, Yang Liu, Jing Zhang, Ke Li and Jicun Lu

J Mater Sci: Mater Electron, 2023, 34
DOI: 10.1007/s10854-023-10951-4

Pressure-constrained sonication activation of flexible printed metal circuit

Lingxiao Cao, Zhonghao Wang, Daiwei Hu, Haoxuan Dong, Chunchun Qu, Yi Zheng, Chao Yang, Rui Zhang, Chunxiao Xing, Zhen Li, Zhe Xin, Du Chen, Zhenghe Song and Zhizhu He

Nat Commun, 2024, 15
DOI: 10.1038/s41467-024-52873-7

Molecular Passivation of Cu via Spontaneous Aryl Diazonium Grafting

Xianli Yu, Hanxiao Lu, Yunlong Dong, Yedong Wang, Rui Xia, Chunmei Zhang, Mingguang Xing, Xin Zhou, Yufen Zong and Hai Cao

Langmuir, 2025, 41, 14118
DOI: 10.1021/acs.langmuir.5c01037

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Chuncheng Wang, Hiroaki Tatsumi, Liang Xu, Tao Zhao, Pengli Zhu, Rong Sun and Hiroshi Nishikawa

ACS Appl. Electron. Mater., 2024, 6, 1718
DOI: 10.1021/acsaelm.3c01629

Effect of magnetron sputtering Ti-doped NbN coating on corrosion and scaling behavior of H62 brass

Wei Li, Can Xiong, Xiulan Li, Xinjun Zhou, Yao Chen, Fei You, Zhengyu Guo, Yuan Zhang and Gui He

Ceramics International, 2026, 52, 1178
DOI: 10.1016/j.ceramint.2025.11.424

Bayesian Optimization of Low-Temperature Nonthermal Plasma Jet Sintering of Nanoinks

Zhongyu Cheng, Ke Wang, Ali M.N. Tanvir, Wenjie Shang, Tengfei Luo, Yanliang Zhang, Alexander W. Dowling and David B. Go

ACS Appl. Mater. Interfaces, 2024, 16, 46897
DOI: 10.1021/acsami.4c07936

Three-Dimensional Porous Copper Conductive Paper

Zheng Li, Xiaoli Ge, Clayton L. Rumsey, Jun Zhang, Qikun Feng, ZhongXuan Wang, Saurabh Khuje, Abdullah Islam, Pratahdeep Gogoi, Martin Trebbin, Yuguang C. Li and Shenqiang Ren

Nano Lett., 2025, 25, 9492
DOI: 10.1021/acs.nanolett.5c02228

Formic Acid-Driven Enhancement of Copper Metal Organic Decomposition Films: Achieving Record-High Conductivity at Low-Processing Temperature

Ting Lin, Ka Ming Ng and Xijun Hu

ACS Appl. Electron. Mater., 2025, 7, 8248
DOI: 10.1021/acsaelm.5c01350

Liquid metals nanotransformer for healthcare biosensors

Yunlong Bai, Jie Zhang, Chennan Lu and Wei Rao

Soft Sci, 2023, 3
DOI: 10.20517/ss.2023.38

The effect of conductive ink alternation on the sustainability and functioning of printed electronics

Mohammad Naji Nassajfar, Marja Välimäki, Liisa Hakola, Kim Eiroma, Kirsi Immonen, Mariam Abdulkareem and Mika Horttanainen

Flex. Print. Electron., 2023, 8, 025015
DOI: 10.1088/2058-8585/acd650

A ligand oxidation structure-adaptive strategy for copper passivation

Liu He, Jingwen Huang, Wenzhen Zheng, Xiaoyu Song, Jie Liu, Huiqiang Lu, Xiaohui Liu, Birong Zeng, Yiting Xu, Conghui Yuan and Lizong Dai

Nat Commun, 2025, 16
DOI: 10.1038/s41467-025-62603-2

Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg and Jaakko Leppäniemi

ACS Appl. Electron. Mater., 2025, 7, 3511
DOI: 10.1021/acsaelm.5c00230

Fabrication and Performance Evaluation of Schottky Diode Device Fabricated Utilizing Ultrathin Silver Nanowires-PEDOT:PSS Composite Electrode

Amna Mir, Muzammil Iqbal, Um-e-Salma Amjad, Lubna Sherin and Maria Mustafa

JOM, 2024, 76, 646
DOI: 10.1007/s11837-023-06055-3

Advancements in corrosion studies and protective measures for copper and copper-based alloys in varied environmental conditions

Okpo O. Ekerenam, Alexander I. Ikeuba, Chigoziri N. Njoku, Demian I. Njoku, Wilfred Emori, Izuchukwu K. Nwokolo, Ini-Ibehe N. Etim, Bright O. Okonkwo, Inime I. Udoh, Enobong F. Daniel, Paul C. Uzoma, Bukola O. Awonusi, Sharafadeen K. Kolawole, Iniobong P. Etim and Olajire S. Olanrele

Results in Engineering, 2025, 26, 105257
DOI: 10.1016/j.rineng.2025.105257

Micron- and nano-sized copper sintering pastes: Materials, processes, and applications

Huijun Cao, Junjie Yuan, Xiang Wu, Tixun Li, Lei Wang, Jonghwan Suhr and Zhihao Zhang

Materials & Design, 2025, 256, 114291
DOI: 10.1016/j.matdes.2025.114291

Convergence of biocompatible printed electronics and sensing in wound dressings: a leap forward in sustainable health monitoring

Manoj Jose, Mani Teja Vijjapu, Lukas Neumaier, Lukas Rauter, Anna Heba Chakkunny, Daniel Corzo, Ronald Thoelen, Antoni Picard, Jürgen Kosel and Wim Deferme

npj Flex Electron, 2025, 9
DOI: 10.1038/s41528-025-00421-8

Polymer Conductive Paste Formulation by Modified Ag2O Particles

Peter Provázek, Alena Pietriková, Peter Lukács and Beáta Ballóková

Acta Electrotechnica et Informatica, 2024, 24, 3
DOI: 10.2478/aei-2024-0001

Direct-Write Copper via Vacuum Cold Spray: Comparing Process Parameters, Line Profiles and Electrical Resistivity

Thomas Hands, Alex Valdez and Paul Fuierer

J Therm Spray Tech, 2026, 35, 338
DOI: 10.1007/s11666-025-02146-6

High-Resolution Printing of Various Electronic Materials by Electrophotography

Chen Yi Ngu, Kaito Kozuki, Hinata Oshida, Sang Bin Lee, Raiki Hanazaki, Sayaka Kado, Kazuhiro Kudo and Masatoshi Sakai

Applied Sciences, 2024, 14, 2668
DOI: 10.3390/app14062668

Composition of Sodium Alginate Films Containing Copper Oxide Nanoparticles Synthesized Using Aqueous Extract of Turnera subulata Sm and Evaluation of Their Healing Potential In Vivo

Felipe Alves Batista, Maria Luiza Raulino Maia, Antônio Luiz Martins Maia Filho, Lívia Alves Filgueiras, José Figueredo‐Silva, Alyne Rodrigues de Araujo‐Nobre and Anderson Nogueira Mendes

Journal of Polymer Science, 2025, 63, 178
DOI: 10.1002/pol.20240500

Printing flexible thin-film transistors

Gengming Zhang, Yunchao Xu, Mustafa Haider, Jia Sun, Dingke Zhang and Junliang Yang

Applied Physics Reviews, 2023, 10
DOI: 10.1063/5.0150361

Improving the Performance of Copper‐Based Metal‐Organic Decomposition Inks Modified with Copper‐Coated Carbon Nanotubes

Lei Zhang, Kenan Yang, Daodao Xue and Shisheng Zhou

ChemistrySelect, 2025, 10
DOI: 10.1002/slct.202405161

Electrically Conductive Inks as Programable Material Systems for Adaptive, Multifunctional, and Sustainable Electronics

Yan Peng, Huaizhi Liu, Peiwen Wu and Jiuyang Zhang

Adv Eng Mater, 2026, 28
DOI: 10.1002/adem.202502794

Thermal Sintering Matchability between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

Meihui Xiao, Lan Zhang, Jiali Li, Lin Chen, Jun Sun, Kun Hu, Yi Gong, Jianjun Ding, Yongxing Lin, Xiangyang Li, Gang Liu, Xian Zhang and Xingyou Tian

Adv Eng Mater, 2024, 26
DOI: 10.1002/adem.202301901

Biodegradable Substrates for Rigid and Flexible Circuit Boards: A Review

Karel Dušek, Daniel Koc, Petr Veselý, Denis Froš and Attila Géczy

Advanced Sustainable Systems, 2025, 9
DOI: 10.1002/adsu.202400518

An empirical-parameter-free approach toward quantitative in situ electron tomography data analysis: in situ observation of metal nanoparticle sintering

Shiro Ihara, Shunsuke Sato, Mizumo Yoshinaga and Mitsuhiro Murayama

Micron, 2025, 198, 103872
DOI: 10.1016/j.micron.2025.103872

High‐performance Cu–Cu interconnects attained through air sintering of oleylamine‐capped Cu nanoparticles for power electronics packaging

Shi‐Yu Xia, Xiang‐Ji Li, Ying‐Jie Guo, Jun‐Jie Yuan, Zhe‐Fei Sun, Hui‐Jun Cao, Shu‐Ye Zhang, Wen‐Zhi Cai, Jin‐Tang Li and Zhi‐Hao Zhang

Rare Metals, 2025, 44, 3281
DOI: 10.1007/s12598-024-03076-y

Dry Printing Pure Copper with High Conductivity and Adhesion for Flexible Electronics

Zabihollah Ahmadi, Aarsh Patel, Curtis Hill, Steven R. Peeples, Jennifer M. Jones, Matthew G. Boebinger and Masoud Mahjouri-Samani

ACS Appl. Electron. Mater., 2024, 6, 3933
DOI: 10.1021/acsaelm.4c00640

A compact tri-notched flexible UWB antenna based on an inkjet-printable and plasma-activated silver nano ink

Wendong Yang, Xun Zhao, Zihao Guo, Haoqiang Sun and Emil J. W. List-Kratochvil

Sci Rep, 2024, 14
DOI: 10.1038/s41598-024-62253-2

Effect of mechanochemical milling on the properties of Ag₂O self-reducing pastes for conductive layers in flexible electronics

Alena Pietrikova, Peter Provazek, Peter Lukacs, Daniel Dzivy, Karel Saksl, Beata Ballokova, Robert Dzunda and Peter Nemergut

J Mater Sci: Mater Electron, 2025, 36
DOI: 10.1007/s10854-025-14893-x

Tuning size distribution of zinc borosilicate glass additives by the length of gallate molecular chain during ball milling for lowering the sintering temperature of copper paste

Jiayi Zhu, Jiahang Li, Chunyu Chen, Qingchao Jia, Qi Jiang, Liangzhu Zhang and Huidan Zeng

J Mater Sci: Mater Electron, 2024, 35
DOI: 10.1007/s10854-024-12736-9

In Situ Synthesis of Nitrogen-Doped Carbon Coated Copper: Boosting Superhydrophobicity, Conductivity, and Oxidation Resistance

Tang Zhu, Xiaochun Chen, Zijuan Zhu, Liru Tan, Huixin Yuan, Jiayi Wu, Caizhen Zhu and Jian Xu

ACS Appl. Mater. Interfaces, 2024, 16, 68703
DOI: 10.1021/acsami.4c16581

Copper Contact for Perovskite Solar Cells: Properties, Interfaces, and Scalable Integration

Shuwei Cao, Jianyong Han, Xiaohu Zhao, Yaming Yu and Peng Gao

Adv Energy and Sustain Res, 2026, 7
DOI: 10.1002/aesr.202500380

Single-step atmospheric pressure plasma jet deposition of copper

Francis Lockwood Estrin, Oliver S J Hagger, Michael A Parkes and Daren J Caruana

Flex. Print. Electron., 2025, 10, 045004
DOI: 10.1088/2058-8585/ae0e81

Flexible printed electronics and their applications in food quality monitoring and intelligent food packaging: Recent advances

Chongze Yue, Jingyi Wang, Zhiqiang Wang, Boyang Kong and Guiying Wang

Food Control, 2023, 154, 109983
DOI: 10.1016/j.foodcont.2023.109983

Enhanced compressive strength of graphene strengthened copper (G/Cu) composites

Deniz Cakir, Omer R Caylan, Erhan Gurpinar, Ogulcan Akgul, H Onat Tugrul, Elif Okay, Eren Atli, Benat Kockar and Goknur Cambaz Buke

Funct. Compos. Struct., 2024, 6, 03LT01
DOI: 10.1088/2631-6331/ad6954

Tripiperidinium pentaformato copper(II) – A unique homoleptic Cu(II) formate

Sebastian Notz, Karoline Müller, Rico Thomas, Tobias Rüffer and Heinrich Lang

Inorganic Chemistry Communications, 2024, 167, 112765
DOI: 10.1016/j.inoche.2024.112765

Air-Sinterable Copper Precursor Inks via Mixed Bidentate/Tridentate Ligands: Synergistic Oxidation Resistance and High Conductivity

Wendong Yang, Xiangyu Yan, Zihao Guo, Yu Wang and Emil J. W. List-Kratochvil

Inorg. Chem., 2025, 64, 17817
DOI: 10.1021/acs.inorgchem.5c02452

Advancing sustainable RF energy harvesting for wearable electronics with 2.45 GHz textile-printed rectennas

J. Tavares, J. Lacik, P. Pinho, Z. Raida and H. Alves

Sci Rep, 2025, 15
DOI: 10.1038/s41598-025-09966-0

Acidic-Induced Liquid Metal–Montmorillonite Self-Sintering Conductive Ink with Multilayer Sandwiched Structure for Flexible Printed Electronics

Zhice Song, Jiao Ma, Rong Fang, Jie Liu and Hua Wang

ACS Appl. Electron. Mater., 2024, 6, 3884
DOI: 10.1021/acsaelm.4c00475