High performance low dielectric polysiloxanes with high thermostability and low water uptake

Abstract

Two novel low dielectric polysiloxanes with high thermostability and low water uptake were developed. These polymers were formed via a thermo-crosslinking reaction of two BCB-containing organosiloxanes. They exhibited dielectric constants (D_k) of less than 2.60 for frequencies ranging from 0.15 to 30.0 MHz, and good thermostability with a 5% weight loss temperature of up to 460 °C. In particular, the polymer derived from a monomer containing three BCB units displayed a T_g of 350 °C. These polymers exhibited water uptakes of less than 0.20% when they were immersed in boiling water for 72 h. These data reflect that these polysiloxanes are suitable as high performance low dielectric resins in the microelectronics industry.