Issue 10, 2019

Bi-continuous pattern formation in thin films via solid-state interfacial dealloying studied by multimodal characterization

Abstract

Bicontinuous-nanostructured materials with a three-dimensionally (3D) interconnected morphology offer unique properties and potential applications in catalysis, biomedical sensing and energy storage. The new approach of solid-state interfacial dealloying (SSID) opens a route for fabricating bi-continuous metal–metal composites and porous metals at nano-/meso-scales via a self-organizing process driven by minimizing the system's free energy. Integrating SSID and thin film processing fully can open up a wide range of technological opportunities in designing novel functional materials; to-date, no experimental evidence has shown that 3D bi-continuous films can be formed with SSID, owing to the complexity of the kinetic mechanisms in thin film geometry and at nano-scales, despite the simple processing strategy in SSID. Here, we demonstrate that a fully-interconnected 3D bi-continuous structure can be achieved by this new approach, thin-film-SSID, using Fe–Ni film dealloyed by Mg film. The formation of a Fe–MgxNi bi-continuous 3D nano-structure was visualized and characterized via a multi-scale, multi-modal approach, combining electron transmission microscopy with synchrotron X-ray fluorescence nano-tomography and absorption spectroscopy. Phenomena involved with structural formation are discussed. These include surface dewetting, nano-size void formation among metallic ligaments, and interaction with a substrate. This work sheds light on the mechanisms of the SSID process, and sets a path for manufacturing of thin-film materials for future nano-structured metallic materials.

Graphical abstract: Bi-continuous pattern formation in thin films via solid-state interfacial dealloying studied by multimodal characterization

Supplementary files

Article information

Article type
Communication
Submitted
29 апр 2019
Accepted
18 июн 2019
First published
19 июн 2019

Mater. Horiz., 2019,6, 1991-2002

Author version available

Bi-continuous pattern formation in thin films via solid-state interfacial dealloying studied by multimodal characterization

C. Zhao, K. Kisslinger, X. Huang, M. Lu, F. Camino, C. Lin, H. Yan, E. Nazaretski, Y. Chu, B. Ravel, M. Liu and Y. K. Chen-Wiegart, Mater. Horiz., 2019, 6, 1991 DOI: 10.1039/C9MH00669A

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements