Issue 13, 2023

Smart microneedle patches for wound healing and management

Abstract

The number of patients with non-healing wounds is generally increasing globally, placing a huge social and economic burden on every country. The complexity of the wound-healing process remains a major health challenge despite the numerous studies that have been reported on conventional wound dressings. Therefore, a therapeutic system that combines diagnostic and therapeutic modalities is essential to monitor wound-related biomarkers and facilitate wound healing in real time. Microneedles, as a multifunctional platform, are promising for transdermal diagnostics and drug delivery. Their advantages are mainly reflected in painless transdermal drug delivery, good biocompatibility, and ease of self-administration. In this work, we review recent advances in the use of microneedle patches for wound healing and monitoring. The paper first provides a brief overview of the skin structure and the wound healing process, and then discusses the current state of research and prospects for the development of wound-related biomarkers and their real-time monitoring based on microneedle sensors. It summarizes the current state of research based on the unique design of microneedle patches, including biomimetic, conductive, and environmentally responsive, to achieve wound healing. It further summarizes the prospects for the application of different microneedle-based drug delivery modalities and drug delivery substances for wound healing, due to their superior transdermal drug delivery advantages. It concludes with challenges and expectations for the use of smart microneedle patches for wound healing and management.

Graphical abstract: Smart microneedle patches for wound healing and management

Article information

Article type
Review Article
Submitted
29 noy 2022
Accepted
24 yan 2023
First published
14 mar 2023

J. Mater. Chem. B, 2023,11, 2830-2851

Smart microneedle patches for wound healing and management

F. Hu, Q. Gao, J. Liu, W. Chen, C. Zheng, Q. Bai, N. Sun, W. Zhang, Y. Zhang and T. Lu, J. Mater. Chem. B, 2023, 11, 2830 DOI: 10.1039/D2TB02596E

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