Issue 74, 2022

Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

Abstract

A general approach to increase the adhesion of metal films to commodity plastic substrates using a metal-chelating polymer, polyethyleneimine, in conjunction with patterned electroless deposition is described. This general fabrication method is compatible with a diverse array of plastics and metals with properties applicable to flexible electronic circuits and electrochemical cells.

Graphical abstract: Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

Supplementary files

Article information

Article type
Communication
Submitted
14 iyl 2022
Accepted
22 avq 2022
First published
22 avq 2022

Chem. Commun., 2022,58, 10337-10340

Author version available

Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

J. R. Wagner, J. Fletcher and S. A. Morin, Chem. Commun., 2022, 58, 10337 DOI: 10.1039/D2CC03848J

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