Issue 40, 2017

Heat-controlled micropillar array device for microsystems technology

Abstract

A new temperature-controlled smart soft material micropillar array has been fabricated via in situ integration of the liquid-crystalline elastomer-based component into the hybrid microdevice. Such design allows for developing pushing elements with fast lifetime values of ca. 5 s, and opens huge opportunities for the use of hybrid smart microdevices with total control on the actuation time/response, repeatability, stability and energy saving.

Graphical abstract: Heat-controlled micropillar array device for microsystems technology

Supplementary files

Article information

Article type
Paper
Submitted
03 ذو القعدة 1438
Accepted
27 ذو الحجة 1438
First published
27 ذو الحجة 1438

Soft Matter, 2017,13, 7264-7272

Heat-controlled micropillar array device for microsystems technology

N. Torras, M. Duque, C. J. Camargo, J. Esteve and A. Sánchez-Ferrer, Soft Matter, 2017, 13, 7264 DOI: 10.1039/C7SM01480E

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements