Issue 74, 2022
From the journal:

Chemical Communications

Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films†

Jessica R. Wagner,a   Jared Fletchera  and  Stephen A. Morin ORCID logo *abc  

* Corresponding authors

a Department of Chemistry, University of Nebraska–Lincoln, Hamilton Hall, Lincoln, NE 68588, USA
E-mail: smorin2@unl.edu
Fax: +402 472-9402
Tel: +402 472-4608

b Nebraska Center for Materials and Nanoscience, University of Nebraska–Lincoln, Lincoln, NE 68588, USA

c Nebraska Center for Integrated Biomolecular Communication, University of Nebraska, Lincoln, NE 68588, USA

Abstract

A general approach to increase the adhesion of metal films to commodity plastic substrates using a metal-chelating polymer, polyethyleneimine, in conjunction with patterned electroless deposition is described. This general fabrication method is compatible with a diverse array of plastics and metals with properties applicable to flexible electronic circuits and electrochemical cells.

Graphical abstract: Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

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Article information

DOI
https://doi.org/10.1039/D2CC03848J
Article type
Communication
Submitted
15 ذو الحجة 1443
Accepted
24 محرم 1444
First published
24 محرم 1444

Chem. Commun., 2022,58, 10337-10340

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Chemical activation of commodity plastics for patterned electroless deposition of robust metallic films

J. R. Wagner, J. Fletcher and S. A. Morin, Chem. Commun., 2022, 58, 10337 DOI: 10.1039/D2CC03848J

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