Choline chloride enhances the electrochemical stability of zinc plating/stripping

Abstract

Herein, choline chloride (CC) is adopted as an additive in an aqueous ZnCl₂ electrolyte to enhance the electrochemical stability of zinc plating/stripping. The choline cation can be adsorbed on the zinc anode surface to inhibit the zinc dendrite growth. Meanwhile, the –OH group can disrupt the initial hydrogen bond networks in the electrolyte, which can alleviate the water-induced side reactions. As a result, the Zn||Zn symmetric cell stably cycles for over 1700 h (1.0 mA cm⁻², 0.5 mA h cm⁻²).