Issue 23, 2021

A handy reversible bonding technology and its application on fabrication of an on-chip liquid metal micro-thermocouple

Abstract

We report a novel reversible bonding technique for liquid metal (LM) microelectrode fabrication in this study. This technique greatly simplifies the process of LM micro-electrode fabrication and can be used to achieve the rapid fabrication of LM blind-end electrodes. Three kinds of treatments, including heat treatment, plasma treatment and heat/plasma treatment, were tested for bonding strength. The experimental results showed that the heat/plasma treatment has the strongest bonding strength. All the three treatments can be completely released by simple water treatment. This handy fabrication method can help to integrate micro-liquid metal electrodes vertically in a microchannel. At the end of this work, this fabrication method was used to integrate liquid metal thermocouples in a microchannel, which greatly shortened the fabrication time and lowered the cost compared with traditional deposition or sputtering methods.

Graphical abstract: A handy reversible bonding technology and its application on fabrication of an on-chip liquid metal micro-thermocouple

Article information

Article type
Paper
Submitted
16 ኦገስ 2021
Accepted
11 ኦክቶ 2021
First published
22 ኦክቶ 2021

Lab Chip, 2021,21, 4566-4573

A handy reversible bonding technology and its application on fabrication of an on-chip liquid metal micro-thermocouple

J. Hong, J. Gong, Q. Li, Z. Deng and L. Gui, Lab Chip, 2021, 21, 4566 DOI: 10.1039/D1LC00726B

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