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Issue 5, 2015
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Self-assembled block copolymer micelles with silver–carbon nanotube hybrid fillers for high performance thermal conduction

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Abstract

The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m−1 K−1 was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160 °C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150 °C as well as multiple heating and cooling cycles of ΔT = 100 °C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.

Graphical abstract: Self-assembled block copolymer micelles with silver–carbon nanotube hybrid fillers for high performance thermal conduction

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Article information


Submitted
30 Oct 2014
Accepted
29 Nov 2014
First published
01 Dec 2014

Nanoscale, 2015,7, 1888-1895
Article type
Paper

Self-assembled block copolymer micelles with silver–carbon nanotube hybrid fillers for high performance thermal conduction

J. R. Choi, S. Yu, H. Jung, S. K. Hwang, R. H. Kim, G. Song, S. H. Cho, I. Bae, S. M. Hong, C. M. Koo and C. Park, Nanoscale, 2015, 7, 1888
DOI: 10.1039/C4NR06390B

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