Rapid bonding of polydimethylsiloxane to stereolithographically manufactured epoxy components using a photogenerated intermediary layer
Abstract
We describe a low cost, photo-induced, room-temperature bonding technique for bonding epoxy components to flexible PDMS membranes in less than half an hour. Bond strengths (∼350 kPa) were characterized by ISO-conform tensile testing for a popular stereolithography resin and found comparable bond strengths as reported for PDMS/PDMS bonds.