Issue 79, 2016

Zero-dimensional to three-dimensional nanojoining: current status and potential applications

Abstract

The continuing miniaturization of microelectronics is pushing advanced manufacturing into nanomanufacturing. Nanojoining is a bottom-up assembly technique that enables functional nanodevice fabrication with dissimilar nanoscopic building blocks and/or molecular components. Various conventional joining techniques have been modified and re-invented for joining nanomaterials. This review surveys recent progress in nanojoining methods, as compared to conventional joining processes. Examples of nanojoining are given and classified by the dimensionality of the joining materials. At each classification, nanojoining is reviewed and discussed according to materials specialties, low dimensional processing features, energy input mechanisms and potential applications. The preparation of new intermetallic materials by reactive nanoscale multilayer foils based on self-propagating high-temperature synthesis is highlighted. This review will provide insight into nanojoining fundamentals and innovative applications in power electronics packaging, plasmonic devices, nanosoldering for printable electronics, 3D printing and space manufacturing.

Graphical abstract: Zero-dimensional to three-dimensional nanojoining: current status and potential applications

Article information

Article type
Review Article
Submitted
19 Jun 2016
Accepted
01 Aug 2016
First published
01 Aug 2016

RSC Adv., 2016,6, 75916-75936

Zero-dimensional to three-dimensional nanojoining: current status and potential applications

Y. Ma, H. Li, D. Bridges, P. Peng, B. Lawrie, Z. Feng and A. Hu, RSC Adv., 2016, 6, 75916 DOI: 10.1039/C6RA15897H

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