Issue 15, 2012

High throughput method for prototyping three-dimensional, paper-based microfluidic devices

Abstract

This paper describes an efficient and high throughput method for fabricating three-dimensional (3D) paper-based microfluidic devices. The method avoids tedious alignment and assembly steps and eliminates a major bottleneck that has hindered the development of these types of devices. A single researcher now can prepare hundreds of devices within 1 h.

Graphical abstract: High throughput method for prototyping three-dimensional, paper-based microfluidic devices

Supplementary files

Article information

Article type
Technical Innovation
Submitted
06 Apr 2012
Accepted
15 May 2012
First published
15 May 2012

Lab Chip, 2012,12, 2630-2633

High throughput method for prototyping three-dimensional, paper-based microfluidic devices

G. G. Lewis, M. J. DiTucci, M. S. Baker and S. T. Phillips, Lab Chip, 2012, 12, 2630 DOI: 10.1039/C2LC40331E

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