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Issue 12, 2018
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Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material

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Abstract

In this study, we used a batch-foaming method to prepare closed-cell poly(vinylidene fluoride) (PVDF) foams with tailored microcellular structures. This is a simple, cost-effective, and environmentally-friendly method, and it offers a wide range of tunable microcellular structures. The cell size and porosity volume of PVDF foams can be effectively monitored at their saturation temperatures. The PVDF foam prepared at 169.5 °C possesses an ultra-low dielectric constant of k ∼ 1.1 and a thermal conductivity of 0.027 W m−1 K−1. We used numerous theoretical models to predict the effective dielectric permittivity of the microcellular PVDF foams, and found that the Bruggeman model was very close to the measured results. The ultra-low thermal conductivities of the PVDF foams were the result of a large number of air pockets in the microcellular structure. Based on these results, we concluded that this PVDF foam would be a promising low-k dielectric and heat insulating material.

Graphical abstract: Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material

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Publication details

The article was received on 01 Feb 2018, accepted on 20 Feb 2018 and first published on 21 Feb 2018


Article type: Paper
DOI: 10.1039/C8TC00547H
Citation: J. Mater. Chem. C, 2018,6, 3065-3073
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    Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material

    B. Zhao, C. Zhao, C. Wang and C. B. Park, J. Mater. Chem. C, 2018, 6, 3065
    DOI: 10.1039/C8TC00547H

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