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Issue 12, 2018
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Self-standing and shape-memorable UV-curing epoxy polymers for three-dimensional (3D) continuous-filament printing

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Abstract

In the development of three-dimensional printable materials for high-speed and high-resolution printing, UV-curing polymers can guarantee fast and precise printing of high performance load-bearing structures, but the injected drops of the monomers tend to spread over the substrates due to their low viscosity. In this study, we imposed the self-standing and shape-memorable capability of an epoxy acrylate (EA) monomer to ensure continuous filamentary 3D printing while maintaining its low viscosity nature. Using octadecanamide (ODA) with EA, strong hydrogen-bond networks (−N−H⋯O[double bond, length as m-dash]C−, −N−C[double bond, length as m-dash]O⋯H–O–, –N–H⋯N–) were additionally achieved in the material system and the developed material distinctively exhibited rheological duality at different processing stages: a low-viscosity liquid-like behavior (viscosity of ∼50 Pa) while passing through the nozzle and a self-standing solid-like behavior (static yield stress of ∼364 Pa) right after being printed. This reversible liquid-to-solid transitional capability was quantified by viscoelastic complex moduli provided a dynamic yield stress (τy,G) of 210 Pa corresponding to the upright stacking up to ∼3.2 cm (3 wt% of ODA). The time (ty,G) required for conformational rearrangement was evaluated to be as fast as ∼10−2 s. After UV curing, the 3D printed layers exhibited no air pockets or weld lines at the stacked interfaces, which could guarantee excellent mechanical performance and structural integrity.

Graphical abstract: Self-standing and shape-memorable UV-curing epoxy polymers for three-dimensional (3D) continuous-filament printing

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Publication details

The article was received on 25 Oct 2017, accepted on 31 Jan 2018 and first published on 07 Mar 2018


Article type: Paper
DOI: 10.1039/C7TC04873D
Citation: J. Mater. Chem. C, 2018,6, 2996-3003
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    Self-standing and shape-memorable UV-curing epoxy polymers for three-dimensional (3D) continuous-filament printing

    H. Sun, Y. Kim, Y. C. Kim, I. K. Park, J. Suhr, D. Byun, H. R. Choi, K. Kuk, O. H. Baek, Y. K. Jung, H. J. Choi, K. J. Kim and J. D. Nam, J. Mater. Chem. C, 2018, 6, 2996
    DOI: 10.1039/C7TC04873D

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