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Copper thiocyanate/copper iodide based hole transport composites with balanced properties for efficient polymer light-emitting diodes

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Abstract

The realization of hole transport materials (HTMs) with balanced properties is challenging. We address this challenge by merging inorganic copper thiocyanate (CuSCN) and copper iodide (CuI) into a composite, and balancing their hole-transport and surface-morphology properties through adjusting the CuI:CuSCN proportion. The advantages of both CuSCN and CuI are brought into play, including the controlled crystalline growth suppressed by the thiocyanate ion (SCN) and the high mobility provided by CuI, thus yielding a cheap, stable, solution- and low-temperature processed HTM with a high transparency and mobility, suitable energy level and smooth surface morphology. The favourable balance is achieved at the CuI proportion of 25 wt%, which affords superior performances with maximum luminance and average current efficiency values of 147 000 cd m−2 and 16.8 cd A−1 for Super Yellow based polymer light-emitting diodes, 134% and 27% higher than that of a PEDOT:PSS based control device, respectively. Our results fulfill the expectation for a HTM with a good trade-off between interface characteristics and optoelectronic properties, providing a pathway for significant applications of inorganic HTMs in organic electronics, such as solar cells and thin-film transistors.

Graphical abstract: Copper thiocyanate/copper iodide based hole transport composites with balanced properties for efficient polymer light-emitting diodes

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Publication details

The article was received on 23 Oct 2017, accepted on 01 Feb 2018 and first published on 01 Feb 2018


Article type: Paper
DOI: 10.1039/C7TC04842D
Citation: J. Mater. Chem. C, 2018, Advance Article
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    Copper thiocyanate/copper iodide based hole transport composites with balanced properties for efficient polymer light-emitting diodes

    W. Luo, C. Zeng, X. Du, C. Leng, W. Yao, H. Shi, X. Wei, C. Du and S. Lu, J. Mater. Chem. C, 2018, Advance Article , DOI: 10.1039/C7TC04842D

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