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Core-Shell Cu@rGO Hybrids Filled in Epoxy Composites with High Thermal Conduction

Abstract

Due to the increased power density of electronic devices, the heat originated from the core components increases the working temperature of the devices, enormously degrading their reliability and shortening their lifespan. So, effective heat dissipation from high-power electronic devices has become an urgent and complex problem. Herein, we report an epoxy-based composite with an enhanced thermal conductivity through using reduced graphene oxide encapsulated copper (Cu@rGO) hybrids as fillers. The Cu@rGO hybrid exhibits 3D structure with high oxidation resistance which can obtain from the XRD and TGA results. We experimentally show that the obtained polymer composites exhibit a high thermal conductivity (7 W m-1 K-1), as the loading of Cu@rGO hybrids is 80 wt %, which is 2.6 time higher than that of the composites filled with the Cu. We attribute the high thermal conductivity to the synergistic effects between Cu and rGO, which enhanced the oxidation resistance of copper and increased the thermal transfer path, along with the reduced interfacial thermal resistance between Cu and epoxy resins. In addition, the Cu@rGO/epoxy composites reveal a decreased thermal expansion coefficient (CTE), an increased glass transition temperature (Tg), and an enhanced shear strength. We believe this unique 3D core-shell Cu@rGO structure and its epoxy composites with high thermal conductivity and dimensional stability, which make it suitable as excellent thermal interface materials in advanced electronic packaging techniques.

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Publication details

The article was received on 28 Sep 2017, accepted on 04 Dec 2017 and first published on 04 Dec 2017


Article type: Paper
DOI: 10.1039/C7TC04427E
Citation: J. Mater. Chem. C, 2017, Accepted Manuscript
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    Core-Shell Cu@rGO Hybrids Filled in Epoxy Composites with High Thermal Conduction

    S. Liu, B. Zhao, L. Jiang, Y. Zhu, X. Fu, R. Sun, J. Xu and C. Wong, J. Mater. Chem. C, 2017, Accepted Manuscript , DOI: 10.1039/C7TC04427E

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