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Fabrication of Sinter-free Conductive Cu Paste using sub-10 nm Copper Nanoparticles

Abstract

We herein describe the fabrication of sinter-free copper nanoparticle-based conductive paste (Cu NPs paste). The copper nanoparticles with the size below 10 nm enable the formation of integrated structure even without heat-treatment. Poly(vinylimidazole-co-vinyltrimethoxysilane) used in the synthesis grant the copper surface a high anti-oxidant ability over a temperture range up to 300 °C at ambient condition. Furthermore, the viscosity of the conductive paste could be arbitrarily adjusted while minimizing the change of the resistivity. The pattern printed using Cu NPs paste demonstrated electrical resistivity of 1.2∙10-2 Ω∙cm for un-sintered conductive paste. We confirmed the potential of the Cu NPs paste through dipole tag antenna application

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Publication details

The article was received on 28 Jun 2017, accepted on 06 Nov 2017 and first published on 06 Nov 2017


Article type: Paper
DOI: 10.1039/C7TC02893H
Citation: J. Mater. Chem. C, 2017, Accepted Manuscript
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    Fabrication of Sinter-free Conductive Cu Paste using sub-10 nm Copper Nanoparticles

    J. Lee, J. Jun, W. Na, J. Oh, Y. K. Kim, W. Kim and J. Jang, J. Mater. Chem. C, 2017, Accepted Manuscript , DOI: 10.1039/C7TC02893H

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