Jump to main content
Jump to site search

Issue 40, 2017
Previous Article Next Article

Solvent-cast based metal 3D printing and secondary metallic infiltration

Author affiliations


Affordable 3D printing methods are needed for the development of high performance metallic structures and devices. We develop a method to fabricate dense metallic structures by combining a room temperature 3D printing and subsequent heat-treatments: sintering and secondary metallic infiltration. The high flexibility of this method enables the fabrication of customized 3D structures, such as fully-filled, porous, interlocked and overhung structures. These geometries are printed using a highly concentrated metallic ink (metallic load up to 98 wt%) consisting of highly alloyed steel (HAS) microparticles, polylactic acid (PLA) and dichloromethane (DCM). In order to improve the mechanical properties and the electrical conductivity, the as-printed structures are sintered and infiltrated by copper in a furnace protected by a mixture of H2 and Ar. The filament porosity of the copper infiltrated samples is as low as 0.2%. Mechanical testing and electrical conductivity measurement on the copper infiltrated structures reveal that the Young's modulus reaches up to ∼195 GPa and the electrical conductivity is as high as 1.42 × 106 S m−1. Our method enables the simple fabrication of high performance metallic structures which could open up new technological applications where cost is an important factor.

Graphical abstract: Solvent-cast based metal 3D printing and secondary metallic infiltration

Back to tab navigation

Supplementary files

Publication details

The article was received on 27 Jun 2017, accepted on 23 Aug 2017 and first published on 23 Aug 2017

Article type: Communication
DOI: 10.1039/C7TC02884A
Citation: J. Mater. Chem. C, 2017,5, 10448-10455
  •   Request permissions

    Solvent-cast based metal 3D printing and secondary metallic infiltration

    C. Xu, A. Bouchemit, G. L’Espérance, L. Laberge Lebel and D. Therriault, J. Mater. Chem. C, 2017, 5, 10448
    DOI: 10.1039/C7TC02884A

Search articles by author