Jump to main content
Jump to site search


Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Author affiliations

Abstract

Here we demonstrate that the building blocks of semiconductor WO3 nanowires can be controllably soldered together via a novel nano-soldering technique of in situ SEM-FIB thermal soldering, in which the soldering temperature can be precisely retained in an optimal range to avoid strong thermal diffusion.

Graphical abstract: Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Back to tab navigation

Supplementary files

Publication details

The article was received on 17 Apr 2017, accepted on 10 Aug 2017 and first published on 10 Aug 2017


Article type: Communication
DOI: 10.1039/C7TC01668A
Citation: J. Mater. Chem. C, 2017, Advance Article
  •   Request permissions

    Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

    X. Zhang, X. Zheng, H. Zhang, J. Zhang, J. Fu, Q. Zhang, C. Peng, F. Bai, X. Zhang and Y. Peng, J. Mater. Chem. C, 2017, Advance Article , DOI: 10.1039/C7TC01668A

Search articles by author

Spotlight

Advertisements