Jump to main content
Jump to site search


Heat-controlled micropillar array device for microsystems technology

Author affiliations

Abstract

A new temperature-controlled smart soft material micropillar array has been fabricated via in situ integration of the liquid-crystalline elastomer-based component into the hybrid microdevice. Such design allows for developing pushing elements with fast lifetime values of ca. 5 s, and opens huge opportunities for the use of hybrid smart microdevices with total control on the actuation time/response, repeatability, stability and energy saving.

Graphical abstract: Heat-controlled micropillar array device for microsystems technology

Back to tab navigation

Supplementary files

Publication details

The article was received on 26 Jul 2017, accepted on 18 Sep 2017 and first published on 18 Sep 2017


Article type: Paper
DOI: 10.1039/C7SM01480E
Citation: Soft Matter, 2017, Advance Article
  •   Request permissions

    Heat-controlled micropillar array device for microsystems technology

    N. Torras, M. Duque, C. J. Camargo, J. Esteve and A. Sánchez-Ferrer, Soft Matter, 2017, Advance Article , DOI: 10.1039/C7SM01480E

Search articles by author

Spotlight

Advertisements