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Superhydrophobic, highly adhesive arrays of copper hollow spheres produced by electro-colloidal lithography

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Abstract

We report the patterning of copper surfaces which display both superhydrophobicity and high adhesion thanks to a new feature geometry, and without resorting to chemical modification. Polystyrene beads organized in 2D crystals under an AC electric field act as a template for the growth of copper deposited via cupric ion-loaded multi-lamellar vesicles. After the removal of the beads, hexagonal arrays of supported hollow spheres or copper bowls are generated, depending on the amount of deposited copper. While the bowl-covered surfaces display a predictable decreasing wettability (Cassie model) as their wall height increases, the hollow sphere-covered surfaces exhibit both high adhesion and superhydrophobicity (Cassie–Baxter state).

Graphical abstract: Superhydrophobic, highly adhesive arrays of copper hollow spheres produced by electro-colloidal lithography

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Publication details

The article was received on 26 Jun 2017, accepted on 01 Aug 2017 and first published on 01 Aug 2017


Article type: Communication
DOI: 10.1039/C7SM01256J
Citation: Soft Matter, 2017, Advance Article
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    Superhydrophobic, highly adhesive arrays of copper hollow spheres produced by electro-colloidal lithography

    D. Bazin and C. Faure, Soft Matter, 2017, Advance Article , DOI: 10.1039/C7SM01256J

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