Jump to main content
Jump to site search


Stiffness-Thermal Conduction Relationship at Composite Interface: Effect of Particle Alignment on Long-range Confinement of Polymer Chains Monitored by Scanning Thermal Microscopy

Abstract

Polymer/filler interface is usually considered as thermal barrier in composites due to the mismatch of phonon frequency across the interface. How interface plays its role in thermal conduction is not fully understood yet. In this work, scanning thermal microscopy is used to map the probe current across the composite interface and force-displacement curves are measured to access the polymer stiffness. Microscale stiffness-thermal conduction relationship is investigated at the composite interface in three representative cases: single aggregated particle domain, two neighboring particle domains and two parallelly aligned particle chains. In the studied poly(vinyl alcohol) (PVA)/Fe3O4 composites, it is revealed that interface property dominates the thermal conduction behavior rather than particle percolation. Long range order of polymer chains surrounding the particle domains is responsible for the enhanced crystallinity and thermal conductivity of the composites. With magnetic alignment of Fe3O4 particles, PVA crystallinity and thermal conductivity can be further enhanced. Macroscopic thermal conductivity measurement is highly consistent with the microscale observation. Specifically, with only 2.3 vol% loading of Fe3O4 in PVA, thermal conductivity can be increased by 56% to 0.42 W/m·K. By magnetic alignment of the particles at the same loading, 133% enhancement of thermal conductivity (~0.63 W/m·K) can be achieved. This work presents an experimental study on the exploration of interface property-thermal conductivity relationship in differently structured micro-domains and reveals the positive role of composite interface in thermal conduction.

Back to tab navigation

Publication details

The article was received on 12 Sep 2017, accepted on 02 Dec 2017 and first published on 04 Dec 2017


Article type: Paper
DOI: 10.1039/C7NR06780A
Citation: Nanoscale, 2017, Accepted Manuscript
  •   Request permissions

    Stiffness-Thermal Conduction Relationship at Composite Interface: Effect of Particle Alignment on Long-range Confinement of Polymer Chains Monitored by Scanning Thermal Microscopy

    Y. Li, N. Mehra, T. Ji, X. Yang, L. Mu, J. Gu and J. Zhu, Nanoscale, 2017, Accepted Manuscript , DOI: 10.1039/C7NR06780A

Search articles by author

Spotlight

Advertisements