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Density-tunable lightweight polymer composites with dual-functional ability of efficient EMI shielding and heat dissipation

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Abstract

Lightweight dual-functional materials with high EMI shielding performance and thermal conductivity are of great importance in modern cutting-edge applications, such as mobile electronics, automotive, aerospace, and military. Unfortunately, a clear material solution has not emerged yet. Herein, we demonstrate a simple and effective way to fabricate lightweight metal-based polymer composites with dual-functional ability of excellent EMI shielding effectiveness and thermal conductivity using expandable polymer bead-templated Cu hollow beads. The low-density Cu hollow beads (ρ ∼ 0.44 g cm−3) were fabricated through electroless plating of Cu on the expanded polymer beads with ultralow density (ρ ∼ 0.02 g cm−3). The resulting composites that formed a continuous 3D Cu network with a very small Cu content (∼9.8 vol%) exhibited excellent EMI shielding (110.7 dB at 7 GHz) and thermal conductivity (7.0 W m−1 K−1) with isotropic features. Moreover, the densities of the composites are tunable from 1.28 to 0.59 g cm−3 in accordance with the purpose of their applications. To the best of our knowledge, the resulting composites are the best lightweight dual-functional materials with exceptionally high EMI SE and thermal conductivity performance among synthetic polymer composites.

Graphical abstract: Density-tunable lightweight polymer composites with dual-functional ability of efficient EMI shielding and heat dissipation

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Publication details

The article was received on 12 Apr 2017, accepted on 15 Jun 2017 and first published on 16 Jun 2017


Article type: Paper
DOI: 10.1039/C7NR02618H
Citation: Nanoscale, 2017, Advance Article
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    Density-tunable lightweight polymer composites with dual-functional ability of efficient EMI shielding and heat dissipation

    S. H. Lee, S. Yu, F. Shahzad, W. N. Kim, C. Park, S. M. Hong and C. M. Koo, Nanoscale, 2017, Advance Article , DOI: 10.1039/C7NR02618H

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