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Issue 24, 2017
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Thickness control of 3-dimensional mesoporous silica ultrathin films by wet-etching

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Abstract

The thickness of 3-dimensional (3D) mesoporous silica ultrathin films was controlled at a single-nanometer scale by wet-etching. A drop casting method with an aqueous etchant of ammonium fluoride was effective in etching the surfaces of films in the direction perpendicular to their substrates. The decrease in the film thickness depends on the interface tension of etching solutions. The wettability of thin films also influences the etching. CoPt nanodots were electrodeposited within ultrathin silica films on Ru substrates to form CoPt nanodot patterns.

Graphical abstract: Thickness control of 3-dimensional mesoporous silica ultrathin films by wet-etching

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Publication details

The article was received on 21 Mar 2017, accepted on 12 May 2017 and first published on 16 May 2017


Article type: Paper
DOI: 10.1039/C7NR01560G
Citation: Nanoscale, 2017,9, 8321-8329
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    Thickness control of 3-dimensional mesoporous silica ultrathin films by wet-etching

    M. Kobayashi, K. Susuki, T. Otani, S. Enomoto, H. Otsuji, Y. Kuroda, H. Wada, A. Shimojima, T. Homma and K. Kuroda, Nanoscale, 2017, 9, 8321
    DOI: 10.1039/C7NR01560G

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