Jump to main content
Jump to site search


Thickness Control of 3-Dimensional Mesoporous Silica Ultrathin Films by Wet-Etching

Abstract

The thickness of 3-dimensional (3D) mesoporous silica ultrathin films was controlled at a single-nanometer scale by wet-etching. A drop casting method with an aqueous etchant of ammonium fluoride, was effective in etching the surfaces of films in the direction perpendicular to their substrates. The decrease in the film thickness depends on the interface tension of etching solutions. The wettability of thin films also influences the etching. CoPt nanodots were electrodeposited within ultrathin silica films on Ru substrates to form CoPt nanodot patterns.

Back to tab navigation
Please wait while Download options loads

Supplementary files

Publication details

The article was received on 21 Mar 2017, accepted on 12 May 2017 and first published on 16 May 2017


Article type: Paper
DOI: 10.1039/C7NR01560G
Citation: Nanoscale, 2017, Accepted Manuscript
  •   Request permissions

    Thickness Control of 3-Dimensional Mesoporous Silica Ultrathin Films by Wet-Etching

    M. Kobayashi, K. Susuki, T. Otani, S. Enomoto, H. Otsuji, Y. Kuroda, H. Wada, A. Shimojima, T. Homma and K. Kuroda, Nanoscale, 2017, Accepted Manuscript , DOI: 10.1039/C7NR01560G

Search articles by author