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Issue 43, 2016
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Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

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Abstract

A convenient and efficient approach for selective metallization of alumina ceramics has been developed. The Ag+-bearing ink was firstly inkjet-printed on alumina ceramics to create catalytic activating layers for subsequent electroless copper plating (ECP), and then ECP was initiated to fabricate the desirable conductive patterns. A continuous copper layer with dense packing could be obtained by controlling the electroless plating process. A low resistivity of about 2.37 μΩ cm of the copper layer was achieved, which was only about 1.4 times higher than that of bulk copper. Moreover, such a copper layer exhibited satisfactory solderability, reliable adhesion to substrates and good stability in an ambient atmosphere. This approach proposed a potential way to realize surface metallization on ceramic substrates without high temperature and any sophisticated equipment.

Graphical abstract: Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

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Publication details

The article was received on 02 Aug 2016, accepted on 10 Oct 2016, published on 10 Oct 2016 and first published online on 10 Oct 2016


Article type: Paper
DOI: 10.1039/C6TC03315F
Citation: J. Mater. Chem. C, 2016,4, 10240-10245
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    Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

    J. Chen, Y. Guo, Y. Wang, J. Zhang, H. Li and Z. Feng, J. Mater. Chem. C, 2016, 4, 10240
    DOI: 10.1039/C6TC03315F

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