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Research Article

Lead-free tin chalcogenide thermoelectric materials

Corresponding authors
Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China
E-mail: mzhou@mail.ipc.ac.cn
Department of Materials Science and Engineering, Northwestern University, Evanston, USA
ITMO University, St Petersburg, Russia
School of Materials Science and Engineering, Beihang University, Beijing 100191, China
E-mail: zhaolidong@buaa.edu.cn
Inorg. Chem. Front., 2016, Advance Article

DOI: 10.1039/C6QI00263C
Received 20 Jul 2016, Accepted 10 Sep 2016
First published online 10 Sep 2016

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