Issue 1, 2016
From the journal:

Lab on a Chip

Inkjet printing of UV-curable adhesive and dielectric inks for microfluidic devices†

E. M. Hamad,a   S. E. R. Bilatto,bc   N. Y. Adly,d   D. S. Correa,bc   B. Wolfrum,de   M. J. Schöning,f   A. Offenhäusser ORCID logo d  and  A. Yakushenko*d  

* Corresponding authors

a Biomedical Engineering Department, School of Applied Medical Sciences, German Jordanian University, Amman, Jordan

b Federal University of São Carlos (UFSCar), Chemistry Department, P. O. Box: 676, São Carlos, SP, Brazil

c National Laboratory for Nanotechnology in Agribusiness (LNNA), Embrapa Instrumentation, 13560-970 São Carlos, São Paulo, Brazil

d Institute of Bioelectronics (PGI-8/ICS-8), Forschungszentrum Jülich, 52425 Jülich, Germany
E-mail: a.yakushenko@fz-juelich.de

e Neuroelectronics, IMETUM, Department of Electrical and Computer Engineering, Technical University of Munich (TUM), Germany & Bernstein Center for Computational Neuroscience Munich, Boltzmannstr. 11, 85748 Garching, Germany

f Institute of Nano- and Biotechnologies, Aachen University of Applied Sciences, Heinrich-Mußmann-Str. 1, 52428 Jülich, Germany

Abstract

Bonding of polymer-based microfluidics to polymer substrates still poses a challenge for Lab-On-a-Chip applications. Especially, when sensing elements are incorporated, patterned deposition of adhesives with curing at ambient conditions is required. Here, we demonstrate a fabrication method for fully printed microfluidic systems with sensing elements using inkjet and stereolithographic 3D-printing.

Graphical abstract: Inkjet printing of UV-curable adhesive and dielectric inks for microfluidic devices

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Article information

DOI
https://doi.org/10.1039/C5LC01195G
Article type
Technical Innovation
Submitted
30 Sep 2015
Accepted
26 Nov 2015
First published
26 Nov 2015

Lab Chip, 2016,16, 70-74

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Inkjet printing of UV-curable adhesive and dielectric inks for microfluidic devices

E. M. Hamad, S. E. R. Bilatto, N. Y. Adly, D. S. Correa, B. Wolfrum, M. J. Schöning, A. Offenhäusser and A. Yakushenko, Lab Chip, 2016, 16, 70 DOI: 10.1039/C5LC01195G

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