Issue 42, 2016

Epitaxial silicides: the case of Fe, Ni, and Ti

Abstract

Ultra-thin epitaxial silicides were formed and their structures were examined by electron microscopy and X-ray diffraction. The epitaxial relationship between the silicides and Si was discovered and examined by electron diffraction patterns. The thickness of the silicide can be controlled by a double-sputtering process, rather than by the amount of deposited metals. Intermediate and low temperature phase silicides (C40-TiSi2 and Fe2Si) were observed, suggesting that process control is also an important factor, rather than the symmetry between the crystal structures of Si and silicide. This study is constructive to the basic understanding of the initial stage of the reaction that leads to epitaxial films on Si, as well as the epitaxial relationship of the crystalline layers. The observations may be useful for future design and application of nano-MOSFET and optoelectronics.

Graphical abstract: Epitaxial silicides: the case of Fe, Ni, and Ti

Supplementary files

Article information

Article type
Communication
Submitted
15 Jun 2016
Accepted
13 Sep 2016
First published
16 Sep 2016

CrystEngComm, 2016,18, 8155-8158

Epitaxial silicides: the case of Fe, Ni, and Ti

C. Hsin and Y. Tsai, CrystEngComm, 2016, 18, 8155 DOI: 10.1039/C6CE01375A

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