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Issue 32, 2016
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A delayed curing ROMP based thermosetting resin

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Abstract

Here, we develop a heat curing thermosetting resin using ring-opening metathesis polymerization. The resin has a prolonged working time at room temperature and cures rapidly at elevated temperatures. We detail the delayed cure activity and investigate the resulting thermal and mechanical properties of the cured materials.

Graphical abstract: A delayed curing ROMP based thermosetting resin

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Publication details

The article was received on 28 Apr 2016, accepted on 19 Jul 2016 and first published on 01 Aug 2016


Article type: Communication
DOI: 10.1039/C6PY00754F
Citation: Polym. Chem., 2016,7, 5093-5098
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    A delayed curing ROMP based thermosetting resin

    R. Baumgartner, K. Ryba, Z. Song, R. Wang, K. Harris, J. S. Katz and J. Cheng, Polym. Chem., 2016, 7, 5093
    DOI: 10.1039/C6PY00754F

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