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Issue 20, 2015
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An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

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Abstract

We report a thin and robust interconnecting layer (ICL) for polymer tandem solar cells. This ICL shows low absorption, good electrical contacts, large work function contrast and robustness. Its use yields tandem cells with a very high fill factor of 76%, making this ICL a promising component of future highly efficient multijunction organic solar cells.

Graphical abstract: An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

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Publication details

The article was received on 26 Mar 2015, accepted on 14 Apr 2015 and first published on 17 Apr 2015


Article type: Communication
DOI: 10.1039/C5TA02205C
Citation: J. Mater. Chem. A, 2015,3, 10681-10686
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    An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

    A. Martínez-Otero, Q. Liu, P. Mantilla-Perez, M. M. Bajo and J. Martorell, J. Mater. Chem. A, 2015, 3, 10681
    DOI: 10.1039/C5TA02205C

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