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Issue 1, 2016
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Electrochemical buckling microfabrication

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Abstract

Can isotropic wet chemical etching be controlled with a spatial resolution at the nanometer scale, especially, for the repetitive microfabrication of hierarchical 3D μ-nanostructures on the continuously curved surface of functional materials? We present an innovative wet chemical etching method called “electrochemical buckling microfabrication”: first, a constant contact force is applied to generate a hierarchical 3D μ-nanostructure on a mold electrode surface through a buckling effect; then, the etchant is electrogenerated on-site and confined close to the mold electrode surface; finally, the buckled hierarchical 3D μ-nanostructures are transferred onto the surface of a GaxIn1−xP coated GaAs wafer through WCE. The concave microlens, with a Fresnel structure, has an enhanced photoluminescence at 630 nm. Comparing with energy beam direct writing techniques and nanoimprint lithography, this method provides an electrochemical microfabrication pathway for the semiconductor industry, with low cost and high throughput.

Graphical abstract: Electrochemical buckling microfabrication

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Publication details

The article was received on 21 Jul 2015, accepted on 20 Oct 2015 and first published on 20 Oct 2015


Article type: Edge Article
DOI: 10.1039/C5SC02644J
Citation: Chem. Sci., 2016,7, 697-701
  • Open access: Creative Commons BY license
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    Electrochemical buckling microfabrication

    J. Zhang, B. Dong, J. Jia, L. Han, F. Wang, C. Liu, Z. Tian, Z. Tian, D. Wang and D. Zhan, Chem. Sci., 2016, 7, 697
    DOI: 10.1039/C5SC02644J

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