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Issue 32, 2015
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Enhanced thermal stability of Cu–silylphosphido complexes via NHC ligation

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Abstract

The facile preparation and structural characterization of [M6{P(SiMe3)2}6] (M = Ag, Cu) is reported. These complexes show limited stability towards solvent loss at ambient temperature; however, N-heterocyclic carbene (NHC) ligands were used to synthesize more thermally stable metal–silylphosphido compounds. 1,3-Di-isopropylbenzimidazole-2-ylidene (iPr2-bimy) and 1,3-bis(2,6-diisopropylphenyl)imidazol-2-ylidene (IPr) are found to be excellent ligands to stabilize silylphosphido–copper compounds that show higher stability when compared to [Cu6{P(SiMe3)2}6].

Graphical abstract: Enhanced thermal stability of Cu–silylphosphido complexes via NHC ligation

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Publication details

The article was received on 29 May 2015, accepted on 03 Jul 2015 and first published on 17 Jul 2015


Article type: Paper
DOI: 10.1039/C5DT02040A
Citation: Dalton Trans., 2015,44, 14235-14241
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    Enhanced thermal stability of Cu–silylphosphido complexes via NHC ligation

    B. Khalili Najafabadi and J. F. Corrigan, Dalton Trans., 2015, 44, 14235
    DOI: 10.1039/C5DT02040A

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