Issue 23, 2014
From the journal:

Chemical Communications

One-step fabrication of a highly conductive and durable copper paste and its flexible dipole tag-antenna application†

Keun-Young Shin,a   James S. Lee,a   Jin-Yong Honga  and  Jyongsik Jang*a  

* Corresponding authors

a World Class University (WCU) Program of Chemical Convergence for Energy & Environment (C2E2), School of Chemical and Biological Engineering, College of Engineering, Seoul National University (SNU), Seoul, Korea
E-mail: jsjang@plaza.snu.ac.kr
Fax: +82 2 888 1604
Tel: +82 2 880 7069

Abstract

A highly conductive and durable copper (Cu) paste was successfully fabricated via acid treatment and mechanical blending with corrosion inhibitors. A screen-printed Cu pattern was evaluated as a dipole tag-antenna with long term and thermal stability, and structural flexibility.

Graphical abstract: One-step fabrication of a highly conductive and durable copper paste and its flexible dipole tag-antenna application

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Article information

DOI
https://doi.org/10.1039/C3CC49782H
Article type
Communication
Submitted
26 Dec 2013
Accepted
30 Jan 2014
First published
11 Feb 2014

Chem. Commun., 2014,50, 3093-3096

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One-step fabrication of a highly conductive and durable copper paste and its flexible dipole tag-antenna application

K. Shin, J. S. Lee, J. Hong and J. Jang, Chem. Commun., 2014, 50, 3093 DOI: 10.1039/C3CC49782H

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