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Issue 10, 2014
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A degradable polycyclic cross-linker for UV-curing nanoimprint lithography

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In this paper, we design and synthesize a degradable polycyclic diacrylate cross-linker, 2,10-diacryloyloxymethyl-1,4,9,12-tetraoxaspiro[] tetradecane (DAMTT), from easily available starting materials by bis-ketalization of 1,4-cyclohexanedione with glycerol, followed by esterification with acryloyl choride. The chemical structure of the degradable cross-linker is characterized by FTIR, 1H NMR and GC-MS. A UV-NIL resist based on DAMTT has a very low shrinkage (about 2.5%) and a high Young's modulus of 1.89 GPa after UV-curing, and is soluble in acidic media. Patterns with sub-10 nm resolution are faithfully imprinted into the DAMTT film. The degradable cross-linker is incorporated with a multifunctional acrylated siloxane to increase O2 RIE resistance as an etch barrier for high aspect ratio pattern transfer. The cross-linked film of the UV-curable resist remains soluble in acidic media even though its formulation contains acrylated siloxane up to 50% (w/w). Moreover, in contrast to most UV-NIL resists which are insoluble in solvents after curing, the DAMTT resist can independently achieve a lift-off process without the assistance of a thermoplastic polymer layer. That makes it possible to fabricate metal nanostructures on highly curved surfaces via a hybrid UV-curing nanoimprint technique. For example, metal gratings are successfully fabricated on the cylindrical surface of an optical fiber via a lift-off process.

Graphical abstract: A degradable polycyclic cross-linker for UV-curing nanoimprint lithography

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The article was received on 16 Oct 2013, accepted on 15 Dec 2013 and first published on 18 Dec 2013

Article type: Paper
DOI: 10.1039/C3TC32048K
Citation: J. Mater. Chem. C, 2014,2, 1836-1843
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    A degradable polycyclic cross-linker for UV-curing nanoimprint lithography

    X. Hu, T. Yang, R. Gu, Y. Cui, C. Yuan, H. Ge, W. Wu, W. Li and Y. Chen, J. Mater. Chem. C, 2014, 2, 1836
    DOI: 10.1039/C3TC32048K

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