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Issue 6, 2013
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Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

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Abstract

A technical bottleneck to the broadening of applications of glass nanofluidic chips is bonding, due to the strict conditions, especially the extremely high temperatures (∼1000 °C) and the high vacuum required in the current glass-to-glass fusion bonding method. Herein, we report a strong, nanostructure-friendly, and high pressure-resistant bonding method, performed at room temperature (RT, ∼25 °C) for glass nanofluidic chips, using a one-step surface activation process with an O2/CF4 gas mixture plasma treatment. The developed RT bonding method is believed to be able to conquer the technical bottleneck in bonding in nanofluidic fields.

Graphical abstract: Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

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Publication details

The article was received on 07 Dec 2012, accepted on 08 Jan 2013 and first published on 09 Jan 2013


Article type: Technical Innovation
DOI: 10.1039/C3LC41345D
Citation: Lab Chip, 2013,13, 1048-1052
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    Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment

    Y. Xu, C. Wang, L. Li, N. Matsumoto, K. Jang, Y. Dong, K. Mawatari, T. Suga and T. Kitamori, Lab Chip, 2013, 13, 1048
    DOI: 10.1039/C3LC41345D

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