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Issue 18, 2013
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Generation of scalable quasi-3D metallo-dielectric SERS substrates through orthogonal reactive ion etching

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Abstract

We combined two orthogonal reactive ion etching strategies on monolayers of 4 μm diameter polystyrene (PS) microspheres assembled on a planar glass substrate to create geometrically diverse but highly regular quasi-3D nano-structured arrays with centimeter length scales. Reactive ion etching (RIE) with O2/CF4 was used to selectively etch PS and, thus, to adjust the morphology of the PS mask, and CHF3 RIE was then used to etch the SiO2 substrate. The dynamic combination of these two etching procedures facilitated the realization of a wide variety of 3D-corrugated surface morphologies, including pedestals, bowls, honeycombs and blossom bud like arrays. The generated structures were then evaporated with Au films of defined thicknesses to generate metallo-dielectric arrays with tunable surface roughness. Hexagonal diffraction patterns from the fabricated structures confirm the successful realization of extended periodic hexagonal structures and the optical transmission spectra showed an efficient trapping of incident light in these ultra-rough metallo-dielectric arrays. The metallo-dielectric substrates were finally optimized for the detection of the pesticide methyl parathion in a concentration as low as 1 × 10−10 M through surface enhanced Raman spectroscopy (SERS).

Graphical abstract: Generation of scalable quasi-3D metallo-dielectric SERS substrates through orthogonal reactive ion etching

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Publication details

The article was received on 17 Jan 2013, accepted on 21 Mar 2013 and first published on 25 Mar 2013


Article type: Paper
DOI: 10.1039/C3TC30110A
Citation: J. Mater. Chem. C, 2013,1, 3110-3118
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    Generation of scalable quasi-3D metallo-dielectric SERS substrates through orthogonal reactive ion etching

    W. Ahn, Y. Qiu and B. M. Reinhard, J. Mater. Chem. C, 2013, 1, 3110
    DOI: 10.1039/C3TC30110A

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