Issue 18, 2012
From the journal:

Journal of Materials Chemistry

Thermally resistant UV-curable epoxy–siloxane hybrid materials for light emitting diode (LED) encapsulation†

SeungCheol Yang,a   Seung-Yeon Kwak,a   JungHo Jin,a   Joon-Soo Kim,a   Yongwon Choi,b   Kyung-Wook Paikb  and  Byeong-Soo Bae*a  

* Corresponding authors

a Laboratory of Optical Materials and Coating (LOMC), Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Republic of Korea
E-mail: bsbae@kaist.ac.kr
Fax: +82 42 350 3310
Tel: +82 42 350 4119

b Nano Packaging and Interconnects Laboratory (NPIL), Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Republic of Korea
E-mail: kwpaik@kaist.ac.kr
Fax: +82 42 350 3310
Tel: +82 42 350 3335

Abstract

A UV-curable epoxy–siloxane hybrid material (epoxy hybrimer) was fabricated by photo-cationic polymerization of a sol–gel derived cyclo-aliphatic epoxy oligosiloxane (CAEO) blended with oxetane cross-linker in the presence of an onium salt. Antioxidants for fabrication of the UV-curable epoxy hybrimer with high thermal resistance against yellowing were incorporated in the UV-curable epoxy hybrimer. The UV-curable epoxy hybrimer with the antioxidants showed high thermal resistance without yellowing during 120 °C thermal aging. High thermal resistance of the UV-curable epoxy hybrimer was similar and higher compared to those of commercial thermally curable silicone and UV-curable epoxy LED encapsulants, respectively. The thermally resistant UV-curable epoxy hybrimer was successfully encapsulated on a LED without any cracking or delamination, and maintained a flat surface on the LED without distortion of the designed flat shape. Before/after thermal and blue light aging, the performance of the LED encapsulated by the UV-curable epoxy hybrimer was not changed. On the basis of its excellent properties as a LED encapsulant, the UV-curable epoxy hybrimer can be utilized as a UV-curable LED encapsulant for white LEDs.

Graphical abstract: Thermally resistant UV-curable epoxy–siloxane hybrid materials for light emitting diode (LED) encapsulation

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Article information

DOI
https://doi.org/10.1039/C2JM16355A
Article type
Paper
Submitted
05 Dec 2011
Accepted
01 Mar 2012
First published
27 Mar 2012

J. Mater. Chem., 2012,22, 8874-8880

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Thermally resistant UV-curable epoxy–siloxane hybrid materials for light emitting diode (LED) encapsulation

S. Yang, S. Kwak, J. Jin, J. Kim, Y. Choi, K. Paik and B. Bae, J. Mater. Chem., 2012, 22, 8874 DOI: 10.1039/C2JM16355A

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