Issue 16, 2010

Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

Abstract

In the fields of MicroElectroMechanical Systems (MEMS) and Lab On a Chip (LOC), a device is often fabricated using diverse substrates which are processed separately and finally assembled together using a bonding process to yield the final device. Here we describe and demonstrate a novel straightforward, rapid and low-temperature bonding technique for the assembly of complete microfluidic devices, at the chip level, by employing an intermediate layer of gluing material. This technique is applicable to a great variety of materials (e.g., glass, SU-8, parylene, UV-curable adhesive) as demonstrated here when using NOA 81 as gluing material. Bonding is firstly characterized in terms of homogeneity and thickness of the gluing layer. Following this, we verified the resistance of the adhesive layer to various organic solvents, acids, bases and conventional buffers. Finally, the assembled devices are successfully utilized for fluidic experiments.

Graphical abstract: Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

Supplementary files

Article information

Article type
Paper
Submitted
17 Mar 2010
Accepted
14 May 2010
First published
17 Jun 2010

Lab Chip, 2010,10, 2115-2121

Low-temperature, simple and fast integration technique of microfluidic chips by using a UV-curable adhesive

R. Arayanarakool, S. Le Gac and A. van den Berg, Lab Chip, 2010, 10, 2115 DOI: 10.1039/C004436A

To request permission to reproduce material from this article, please go to the Copyright Clearance Center request page.

If you are an author contributing to an RSC publication, you do not need to request permission provided correct acknowledgement is given.

If you are the author of this article, you do not need to request permission to reproduce figures and diagrams provided correct acknowledgement is given. If you want to reproduce the whole article in a third-party publication (excluding your thesis/dissertation for which permission is not required) please go to the Copyright Clearance Center request page.

Read more about how to correctly acknowledge RSC content.

Social activity

Spotlight

Advertisements