Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

Abstract

An easy and elegant method of CNT nanocircuit fabrication using a metal organic precursor of Pd, namely, Pd hexadecanethiolate, is presented. This precursor directs the self-assembly of individual CNTs spanning a gap between Au electrodes. This is achieved by first patterning the precursor along the edges of the gap electrodes, as it enables direct patterning by e beam. Further, thermal activation of the precursor at 250 °C leads to metallization and the ohmic electrical contact between the CNTs and the electrodes beneath. A resistive fuse action of the soldered CNTs is observed as well.