Jump to main content
Jump to site search

Issue 2, 2009
Previous Article Next Article

Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

Author affiliations

Abstract

An easy and elegant method of CNT nanocircuit fabrication using a metal organic precursor of Pd, namely, Pd hexadecanethiolate, is presented. This precursor directs the self-assembly of individual CNTs spanning a gap between Au electrodes. This is achieved by first patterning the precursor along the edges of the gap electrodes, as it enables direct patterning by e beam. Further, thermal activation of the precursor at 250 °C leads to metallization and the ohmic electrical contact between the CNTs and the electrodes beneath. A resistive fuse action of the soldered CNTs is observed as well.

Graphical abstract: Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

Back to tab navigation

Supplementary files

Publication details

The article was received on 23 Apr 2009, accepted on 14 Aug 2009 and first published on 16 Sep 2009


Article type: Paper
DOI: 10.1039/B9NR00035F
Citation: Nanoscale, 2009,1, 271-275
  •   Request permissions

    Self-assembled CNT circuits with ohmic contacts using Pd hexadecanethiolate as in situ solder

    T. Bhuvana, K. C. Smith, T. S. Fisher and G. U. Kulkarni, Nanoscale, 2009, 1, 271
    DOI: 10.1039/B9NR00035F

Search articles by author

Spotlight

Advertisements