Kinetic study in a microwave-induced plasma afterglow of the Cu(4 2S) atom reaction with N2O from 458 to 980 K and with NO2 from 303 to 762 K

Abstract

The rate constants for the reaction of ground-state copper atoms (4 ²S) with N₂O and NO₂ have been derived in a fast-flow reactor. The microwave-induced plasma (MIP) afterglow technique was used for the generation of copper atoms in the gas phase. The rate constant for the reaction Cu(4 ²S)+ N₂O → CuO + N₂ at temperatures between 458 and 980 K is found to be (2.4 ± 0.6)× 10^–10 exp –(48.6 ± 1.4 kJ mol^–1/RT) cm³ molecule^–1 s^–1. The reaction Cu(4 ²S)+ NO₂→ products, was followed in the temperature range from 303 to 762 K and has a rate constant (1.3 ± 0.6)× 10^–11 exp –(0.2 ± 1.3 kJ mol^–1/RT) cm³ molecule^–1 s^–1. From the copper atom decays in argon at 528 K, a diffusion coefficient, D_{Cu, Ar}= 543.2 ± 60.2 cm² Torr s^–1, could be derived.