Issue 15, 2024

Leveraging the Cu2SnTe3 additive for an improved thermoelectric figure of merit and module efficiency in Bi0.5Sb1.5Te3-based composites

Abstract

As a benchmark for commercial room-temperature thermoelectric (TE) materials, the widespread demand for recovering distributed low-grade waste heat (below 573 K) underscores the immediate necessity for advanced Bi2Te3-based alloys. Here, we achieved a 22% enhancement of the peak ZT to 1.43 at 325 K by incorporating highly reactive additive Cu2SnTe3 into Bi0.5Sb1.5Te3, which is notably higher than that of most BixSb2−xTe3-based composites. This remarkable enhancement is facilitated by the in situ reaction of decomposition products with the matrix, thereby boosting hole concentration and the density-of-states effective mass, while experiencing little loss in hole mobility. Simultaneously, the lattice thermal conductivity is significantly reduced by multiscale scattering sources, typical of dislocation arrays and Sb and Cu-rich nanoprecipitates. These synergistic results yield a 30% enhancement of the TE quality factor at 300 K, reaching 0.52 for the optimal Bi0.5Sb1.5Te3 + 0.08 wt% Cu2SnTe3 sample. More significantly, when coupled with n-type zone-melted Bi2Te2.7Se0.3, the well-designed 17-pair TE module achieves a conversion efficiency of ∼6.0%, surpassing the majority of reported Bi2Te3-based modules, which further demonstrates the efficacy of the Cu2SnTe3 compositing strategy and the great potential for practical applications.

Graphical abstract: Leveraging the Cu2SnTe3 additive for an improved thermoelectric figure of merit and module efficiency in Bi0.5Sb1.5Te3-based composites

Supplementary files

Article information

Article type
Paper
Submitted
24 Jan 2024
Accepted
08 Mar 2024
First published
08 Mar 2024

J. Mater. Chem. A, 2024,12, 8785-8795

Leveraging the Cu2SnTe3 additive for an improved thermoelectric figure of merit and module efficiency in Bi0.5Sb1.5Te3-based composites

Q. Pan, K. Pang, Q. Zhang, Y. Liu, H. Shi, J. Li, W. Zhou, Q. Sun, Y. Zhang, X. Tan, P. Sun, J. Wu, G. Liu and J. Jiang, J. Mater. Chem. A, 2024, 12, 8785 DOI: 10.1039/D4TA00552J

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