Copper oxide activation of soft-templated mesoporous carbons and their electrochemical properties for capacitors†
Abstract
Ordered mesoporous carbon with a 2-D hexagonal mesostructure was prepared by an organic–organic co-assembly method. The mesoporous carbon was activated by using CuO to improve its mesoporosity. Compared with pristine mesoporous carbon (PMC-900) carbonized at 900 °C, the mean mesopore size of the activated mesoporous carbon (AMC-900) is increased from 3.2 to 5.5 nm by an etching reaction between copper oxide and the inner layer of the carbonaceous mesochannels.