Free-standing film electronics using photo-crosslinking layer-by-layer assembly†
Abstract
A robust and efficient strategy for preparing a substrate for highly flexible and patchable electronics was developed via a photo-crosslinking LbL
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* Corresponding authors
a
School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul 136-702, Korea
E-mail:
jinhanm@kookmin.ac.kr
b Division of Nano Sciences (BK 21) and Department of Chemistry, Ewha Womans University, Seoul 120-750, Korea
c Department of Chemical and Biological Engineering, Korea University, Seoul, Korea
d Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Korea
e
Department of Nano Science & Technology, Graduate School of Convergence Science and Technology, Seoul National University, Seoul, Korea
E-mail:
younskim@snu.ac.kr
A robust and efficient strategy for preparing a substrate for highly flexible and patchable electronics was developed via a photo-crosslinking LbL
J. Park, J. Kim, S. Lee, J. Bang, B. J. Kim, Y. S. Kim and J. Cho, J. Mater. Chem., 2009, 19, 4488 DOI: 10.1039/B908568H
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