Efficient electroless nickel plating from highly active Ni–B nanoparticles for electric circuit patterns on Al2O3 ceramics

Teng Zhai; Xihong Lu; Guofeng Cui; Gang Wu; Junxiong Qu; Yexiang Tong

doi:10.1039/C3TC31048E

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Efficient electroless nickel plating from highly active Ni–B nanoparticles for electric circuit patterns on Al₂O₃ ceramics†

Teng Zhai,^a Xihong Lu,^a Guofeng Cui,*^a Gang Wu,^b Junxiong Qu^a and Yexiang Tong^a

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* Corresponding authors

^a Key Laboratory of Low-carbon Chemistry & Energy Conservation of Guangdong Province, Huizhou Research Institute of Sun Yat-sen University, School of Chemistry and Chemical Engineering, Sun-Yat Sen University, GuangZhou, P.R. China
E-mail: cuigf@mail.sysu.edu.cn

^b Materials Physics & Applications Division, Los Alamos National Laboratory, Los Alamos, NM 87545, USA

Abstract

Herein, we report novel and highly-active Ni–B nanoparticles as a precursor for electroless nickel deposition and demonstrate their implementation as high-performance electric circuits on the CCPCB surface.

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Article information

DOI: https://doi.org/10.1039/C3TC31048E
Article type: Paper
Submitted: 02 Jun 2013
Accepted: 20 Jun 2013
First published: 20 Jun 2013

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J. Mater. Chem. C, 2013,1, 5149-5152

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Efficient electroless nickel plating from highly active Ni–B nanoparticles for electric circuit patterns on Al₂O₃ ceramics

T. Zhai, X. Lu, G. Cui, G. Wu, J. Qu and Y. Tong, J. Mater. Chem. C, 2013, 1, 5149 DOI: 10.1039/C3TC31048E

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Journal of Materials Chemistry C