Patterning micron-sized features in a cross-linked poly(acrylic acid) film by a wet etching process

Abstract

This paper describes a photolithographic method to create sub-micron-scale patterns of cation-cross-linked poly(acrylic acid) (CCL-PAA). PAA can be cross-linked with a wide range of metal cations—including, but not limited to, Ag⁺, Ca²⁺, Pd²⁺, Al³⁺, La³⁺, and Ti⁴⁺. Upon patterning a positive photoresist (diazonaphthoquinone-novolac resin) on a film of CCL-PAA, the exposed regions of CCL-PAA were etched by either an aqueous NaOH or EDTA solution. The initial cross-linking cation could be exchanged for a second cation that could not be patterned photolithographically. We used these patterned films of CCL-PAA i) to host and template the reduction of metallic cations to metallic nanoparticles, and ii) to fabricate porous, low-k dielectric substrates.