Issue 26, 2012

Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

Abstract

Heat-sensitive components packaging requires low temperature joining technology. The present study considers the feasibility of room-temperature pressureless joining of copper wires using silver nanowire paste. These joints achieve a tensile strength of 5.7 MPa and exhibit ultralow resistivity in the range of 101 nΩ m. An “in situ cleaning” action of PVP is proposed during the bonding process.

Graphical abstract: Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

Supplementary files

Article information

Article type
Communication
Submitted
30 Mar 2012
Accepted
05 May 2012
First published
10 May 2012

J. Mater. Chem., 2012,22, 12997-13001

Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

P. Peng, A. Hu, H. Huang, A. P. Gerlich, B. Zhao and Y. N. Zhou, J. Mater. Chem., 2012, 22, 12997 DOI: 10.1039/C2JM31979A

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