Printed Cu source/drain electrode capped by CuO hole injection layer for organic thin film transistors

Abstract

Using conductive functional ink comprising Cu/CuO core–shell nanoparticles, we present the printed Cu source/drain electrode surrounded by a CuO hole injection layer for organic thin-film transistors. The inherent CuO hole injection layer facilitates the transistor with electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode, without additional physical or chemical treatments for obtaining an energetically compatible interface between the electrode and p-type organic semiconductor.