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Issue 26, 2008
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Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

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Abstract

We present a facile, room temperature and “fully liquid” method to specifically produce either copper nanoparticles or thin conductive copper films on silicon substrates by using a dedicated reduction process of mesitylcopper by H2 or an aminoborane.

Graphical abstract: Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

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Publication details

The article was received on 17 Mar 2008, accepted on 16 May 2008 and first published on 27 May 2008


Article type: Communication
DOI: 10.1039/B804460K
Citation: J. Mater. Chem., 2008,18, 3084-3086
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    Copper nanoparticles and organometallic chemical liquid deposition (OMCLD) for substrate metallization

    C. Barrière, G. Alcaraz, O. Margeat, P. Fau, J. B. Quoirin, C. Anceau and B. Chaudret, J. Mater. Chem., 2008, 18, 3084
    DOI: 10.1039/B804460K

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